Millimeter-wave Low Noise Amplifier Packaging Based on Wafer-level Fan-out Process
• EMC reconstituted wafer is used to embed low-noise amplifier chip with back soldering molybdenum copper sheet, which is integrated with TMV adapter board to meet the requirements of direct grounding on the back of the chip and RDL grounding on the front.
• The front adopts a two-layer PI two-layer metal structure, which interconnects the RF signal with the surface GCPW transmission line through the wrong hole
• In the 24.25~33GHz frequency band, low noise gain deterioration after packaging ≤ 1dB, noise figure deterioration ≤ 0.1dB
• 2dB deterioration of port reflection coefficient
Classification:
Package Antenna and Process Display
Keywords: EDA software and chip display
- Product Description
Online Message
Address: Address: Building A3, Phase 1, Pinghu Zhichuangyuan, No. 288, Zhongnan Section, Fushan Road, Zhong Street, Pinghu City, Zhejiang Province
Contact: Dr. Lin
Contact Phone:133 0573 5905
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It is committed to heterogeneous integration, millimeter wave RF testing, EDA and artificial intelligence integrated services
Service Content
1. Millimeter wave antenna and on-chip antenna test;
2. Testing of electromagnetic properties of materials;
3. Millimeter wave vehicle radar transceiver test;
4. Integrated packaging process.
Contact Us
Add: Building A3, Phase 1, Pinghu Zhichuangyuan, No. 288, Zhongnan Section, Fushan Road, Zhong Street, Pinghu City, Zhejiang Province
Contact: Dr. Lin
Contact Phone: 133 0573 5905
Mailbox: xieyuefeng@cmrft-yrd.com
Focus on us