D-band silicon-based BCB thin film heterogeneous/heterogeneous integration process and sample
• Integration of antenna and active components: the antenna and active chip are integrated on the same silicon substrate to reduce interconnection loss and improve integration
Classification:
Integrated RF Front End Presentation
Keywords: EDA software and chip display
- Product Description
Online Message
Address: Address: Building A3, Phase 1, Pinghu Zhichuangyuan, No. 288, Zhongnan Section, Fushan Road, Zhong Street, Pinghu City, Zhejiang Province
Contact: Dr. Lin
Contact Phone:133 0573 5905
Focus on us
It is committed to heterogeneous integration, millimeter wave RF testing, EDA and artificial intelligence integrated services
Service Content
1. Millimeter wave antenna and on-chip antenna test;
2. Testing of electromagnetic properties of materials;
3. Millimeter wave vehicle radar transceiver test;
4. Integrated packaging process.
Contact Us
Add: Building A3, Phase 1, Pinghu Zhichuangyuan, No. 288, Zhongnan Section, Fushan Road, Zhong Street, Pinghu City, Zhejiang Province
Contact: Dr. Lin
Contact Phone: 133 0573 5905
Mailbox: xieyuefeng@cmrft-yrd.com
Focus on us