封装天线与工艺展示
• 面向5G毫米波增强型移动宽带应用
• 融合天线阵面、馈电网络、滤波器等多种功能，简化架构，减小损耗
• 基于多层低温共烧陶瓷(LTCC)工艺，三维集成结构紧凑
• 适合与芯片一体化集成为封装天线(AiP)
Classification:
Package Antenna and Process Display
Keywords: EDA software and chip display
- Product Description
Online Message
Address: Address: Building A3, Phase 1, Pinghu Zhichuangyuan, No. 288, Zhongnan Section, Fushan Road, Zhong Street, Pinghu City, Zhejiang Province
Contact: Dr. Lin
Contact Phone:133 0573 5905
Focus on us
It is committed to heterogeneous integration, millimeter wave RF testing, EDA and artificial intelligence integrated services
Service Content
1. Millimeter wave antenna and on-chip antenna test;
2. Testing of electromagnetic properties of materials;
3. Millimeter wave vehicle radar transceiver test;
4. Integrated packaging process.
Contact Us
Add: Building A3, Phase 1, Pinghu Zhichuangyuan, No. 288, Zhongnan Section, Fushan Road, Zhong Street, Pinghu City, Zhejiang Province
Contact: Dr. Lin
Contact Phone: 133 0573 5905
Mailbox: xieyuefeng@cmrft-yrd.com
Focus on us