Packaging Interconnection Based on Silicon-based Multilayer BCB Thin Film Process
• Silicon-based package interconnection: with high precision, high compatibility, high density, suitable for heterogeneous/heterogeneous device interconnection and other advantages
• substrate integrated coaxial line interconnection: with low loss, high broadband, closed structure and other advantages
Classification:
Package Antenna and Process Display
Keywords: EDA software and chip display
- Product Description
Online Message
Address: Address: Building A3, Phase 1, Pinghu Zhichuangyuan, No. 288, Zhongnan Section, Fushan Road, Zhong Street, Pinghu City, Zhejiang Province
Contact: Dr. Lin
Contact Phone:133 0573 5905
Focus on us
It is committed to heterogeneous integration, millimeter wave RF testing, EDA and artificial intelligence integrated services
Service Content
1. Millimeter wave antenna and on-chip antenna test;
2. Testing of electromagnetic properties of materials;
3. Millimeter wave vehicle radar transceiver test;
4. Integrated packaging process.
Contact Us
Add: Building A3, Phase 1, Pinghu Zhichuangyuan, No. 288, Zhongnan Section, Fushan Road, Zhong Street, Pinghu City, Zhejiang Province
Contact: Dr. Lin
Contact Phone: 133 0573 5905
Mailbox: xieyuefeng@cmrft-yrd.com
Focus on us