Ka-band three-dimensional integrated launch front-end
Technical features
• Multi-layer mounting of RF/digital control devices
• Passive devices embedded in multi-layer package substrate.
• Active passive three-dimensional integration
• Multi-layer mounting of RF/digital control devices
• Passive devices embedded in multi-layer package substrate.
• Active passive three-dimensional integration
Classification:
Integrated RF Front End Presentation
Keywords: EDA software and chip display
- Product Description
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