HSPMY64D316G1XX11I00

This product is a SIP-grade package based on domestic DDR3 core, with a package size of 17mm x 10mm. The electrical characteristics of the product comply with JESD79-3F DDR3 SDRAM standard. The 64-bit memory chip consists of four 16-bit DDR3/3L bare chips, terminal resistors, and capacitors. The product design conforms to industrial standards and can be widely used in data caching and data processing.

Classification:

SiP (System in Package) Product Show

Keywords: EDA software and chip display

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