HSPMY32D308G1XX11I00
This product is a SIP-grade package product based on domestic DDR3 core, with a package size of 8.5mm x 10mm. The electrical characteristics of the product comply with JESD79-3F DDR3 SDRAM standard. The 32-bit memory chip consists of two 16-bit DDR3/3L bare chips, terminal resistors, and capacitors. The product design conforms to industrial standards and can be widely used in data caching and data processing.
Classification:
SiP (System in Package) Product Show
Keywords: EDA software and chip display
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