Silicon-based multi-layer BCB film heterogeneous/heterogeneous integration process and sample.
• Multi-layer photosensitive BCB film wiring: low loss, high density, high stability, can be embedded in passive devices and other advantages
Classification:
Package Antenna and Process Display
Keywords: EDA software and chip display
- Product Description
Online Message
Address: Address: Building A3, Phase 1, Pinghu Zhichuangyuan, No. 288, Zhongnan Section, Fushan Road, Zhong Street, Pinghu City, Zhejiang Province
Contact: Dr. Lin
Contact Phone:133 0573 5905
Focus on us
It is committed to heterogeneous integration, millimeter wave RF testing, EDA and artificial intelligence integrated services
Service Content
1. Millimeter wave antenna and on-chip antenna test;
2. Testing of electromagnetic properties of materials;
3. Millimeter wave vehicle radar transceiver test;
4. Integrated packaging process.
Contact Us
Add: Building A3, Phase 1, Pinghu Zhichuangyuan, No. 288, Zhongnan Section, Fushan Road, Zhong Street, Pinghu City, Zhejiang Province
Contact: Dr. Lin
Contact Phone: 133 0573 5905
Mailbox: xieyuefeng@cmrft-yrd.com
Focus on us