5G Millimeter Wave LTCC Package Filtering Antenna Array
Technical features
• For 5G millimeter wave enhanced mobile broadband applications
• Fusion antenna array, feed network, filter and other functions, simplify the architecture, reduce loss
• Based on multi-layer low temperature co-fired ceramic (LTCC) process, three-dimensional integrated compact structure
• Suitable for integration with the chip as a package antenna (AiP)
• For 5G millimeter wave enhanced mobile broadband applications
• Fusion antenna array, feed network, filter and other functions, simplify the architecture, reduce loss
• Based on multi-layer low temperature co-fired ceramic (LTCC) process, three-dimensional integrated compact structure
• Suitable for integration with the chip as a package antenna (AiP)
Classification:
Package Antenna and Process Display
Keywords: EDA software and chip display
- Product Description
Online Message
